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[Work Example] WLCSP Rework

Supporting everything from tiny components to large BGAs! Introducing our achievements in WLCSP (Wafer Level Chip Size Package) rework.

Here is an introduction to a case where we received a request for WLCSP rework. WLCSP (Wafer Level Chip Size Package) is a package size equivalent to a bare chip called a die, and is considered one of the smallest levels in semiconductors. The requested component also has an outer dimension of 1.5mm and a pitch of 0.4mm. This time, we replaced the part that had been coated with a preservative, ensuring that there were no remnants left behind during the work. [Case Overview] ■ Content: Replacement of the part coated with a preservative ■ Outer Dimension: 1.5mm ■ Pitch: 0.4mm *For more details, please download the PDF or feel free to contact us.